OSCO offers micro-scale thermal and power management products designed and manufactured by Nextreme that overcome thermal and power constraints in electronics for the semiconductor, photonics, consumer, automotive and defence/aerospace industries.

Technology

• Nano-engineered thin-film thermoelectric based on the Peltier effect (cooling) and Seebeck effect (power generation).
• Uses proven, fully scalable process to deliver new, functionality at the discrete, chip and wafer levels.
• Fully scalable technology integrates seamlessly into the widely accepted copper pillar bumping process used by Intel, Amkor, Casio and other industry leaders.
• Implementation requires only a circuit design change and minimises the need for manufacturing changes.

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