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Thermal Material

Thermal interface material is a crucial component when it comes to protecting and maintaining the longevity of electronic devices. At OSCO, we have a range of thermal interface material types suited for different applications.


How does thermal interface material work?

TIMs are used to increase the efficiency thermal energy transfer between a heat source and a heat sink – also known as the heat dissipation device.
Due to the rough surface of some devices, contact resistance can form which creates a barrier for heat transfer. This is where TIMs come into action as they can fill the void that forms between the heat source and heat sink and allows for the heat transfer to take place smoothly.
 

Why choose OSCO for your thermal interface material?

We work with SARCON, a highly developed silicone rubber material with exceptional flame-resistance and thermal conductivity properties. By amalgamating the inherent silicone rubber properties of electrical insulation, heat resistance and long-term aging into a single compound, thermal interface material configurations can be supplied to a vast variety of industries.
The benefits of using SARCON for the design of thermal interface material are as follows:
  • Long-term reliability and durability
  • High thermal impedance
  • Stable chemical compatibility with metals, plastics and ceramics

You can browse through our range of thermal interface materials we have available below and if you would like to discuss their features in more detail, you can get in touch on our contact page.  

SARCON Thermal Conductivity List SARCON Product Selection Guide
SARCON THERMAL MATERIAL SELECTION GUIDE SARCON THERMAL MATERIAL THICKNESS GUIDE  
Thin Interface Material
Thin Film Materials with high electric isolation and high mechanical strength.
Gap FIller Pads
General Purpose Heat Transferring Pads in many thicknesses.
High Performance Gap Filler Pads
Materials for ultimate heat transfer with low thermal resistance.
Silicone Putty
High Thermally Conducting Materials with low compression and a tacky surface.
Form in Place Gap Filler
High heat transferring syringed materials for wider gaps with improved compressibility.
Non Silicone Gap Filler Pads
Materials with non-silicone formulations in varied thicknesses.
Electromagnetic Wave Absorber
Material used to absorb and reduce a range of electromagnetic waves.
Conductive Greases
Silicone and Non-silicone Materials for the thinnest gaps with high heat transfer.
Thermal Sleeves
Flexible structures in a large material selection available in custom lengths and diameters.
Thermal Cases
Box Shaped Caps with high dissipation rates in standard and custom sizes.
Thermal Tape
A large material selection available in rolls with excellent mechanical and physical characteristics.
Die-Cut Gaskets
Materials effective as a mounting cushion to prevent deformation.
Fusible Tape
Self-fusing silicone rubber electrical tape.
Discontinued Thermal Materials
An overview of our Thermal Materials that have been discontinued, with stock available for existing customers only.
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