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Form in Place Gap Filler

SARCON Form in Place Gap Fillers are silicone compounds with the qualities of high viscosity, thermal conductivity and are highly conformable.


Recently, there has been a trend to integrate higher frequency electronics into smaller devices and SARCON Form in Place Gap Filler provides a thermal solution and can undoubtedly form to the majority of components dimensions and profiles. They make total and dependable constant contact with the component and differing surfaces whilst offering better quality handling properties to thermal greases and potting materials.

Our Form in Place Gap Filler Pads will fill large gaps whilst providing superior thermal transfer.

Key Features of Form in Place Gap Filler:

  • Thermal Conductivity up to 5.0 W/m-K.
  • Conformable with very low compression force.
  • Excellent vibration absorption capabilities.
  • Will not cause corrosion on any metal surface.
  • Requires no heat curing.
  • Available in pre-filled syringes of 30cc and cartridges of 325cc.

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Material Properties Unit SPG-20A SPG-20B SPG-30B SPG-50A
Thermal Conductivity W/m-K (Hot Disk) 2.0 2.1 3.1 5.0
Syringe Availability cc 30cc, 325cc 30cc, 325cc 30cc, 325cc 30cc, 325cc
Recommended Operating Temperature
-40 to +150 -40 to +150 -40 to +150 -40 to +150
°F -40 to +302 -40 to +302 -40 to +302 -40 to +302
Viscosity Pa-s 1.0 (1/s) 600 1000 2600 4100
Pa-s 0.5 (1/s) 1000 1700 4000 6900
Colour N/A Light Grey Light Grey Apricot Light Blue
Data Sheet N/A Data Sheet Download
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