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Electromagnetic Wave Absorber

Our EGR-11F material is available in 0.5, 1.0 and 1.5mm thicknesses in order to meet a variety of application requirements.

EGR-11F is a Silicone Gap Filler Pad effective to absorb and damp a wide range of Electromagnetic Waves. In addition, the material is a high thermal interface material performer. 

This material easily fills small gaps of IC chip surfaces with a soft gel texture and offers good workability to circuit boards due to the self-adhesive gel surface with no adhesive tape required for assembly.

Key Features:

  • Thermal Conductivity of 1.0W/m-K (Hot Wire Test Method) and 0.8W/m-K (Hot Disk Test Method).
  • Available in a 0.5, 1.0 and 1.5 thickness.
  • Easy to apply.
  • Extremely low level of low molecular siloxane.

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Material Properties Unit EGR-11F
Thermal Conductivity
W/m-K
(Hot Wire)
1.0
W/m-K
(Hot Disk)
0.8
Thickness Availability mm 0.5, 1.0 and 1.5
Recommended Operating Temperature
°C
 
-30 to +120
°F -22 to +248
Hardness Shore OO 56
Colour N/A Dark Grey
Data Sheet PDF Data Sheet Download
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